DISCO CORPORATION
1,541Patents
1,402Active
1,541Granted
63Portfolio score
Filing activity: Jun 2, 1978 → May 8, 2024 · 188 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6528864B1 | Semiconductor wafer having regular or irregular chip pattern and dicing method for the same | Electricity | 145 | Expired |
| US6465158B1 | Semiconductor wafer dividing method | Electricity | 129 | Expired |
| US7265033B2 | Laser beam processing method for a semiconductor wafer | Electricity | 127 | Expired |
| US6998571B2 | Laser beam processing machine | Performing Operations; Transporting | 124 | Expired |
| US7129150B2 | Method of dividing a semiconductor wafer | Emerging Cross-Sectional Technologies | 123 | Expired |
| US7179723B2 | Wafer processing method | Electricity | 122 | Expired |
| US6803247B2 | Method for dividing semiconductor wafer | Electricity | 119 | Expired |
| US7473866B2 | Laser processing apparatus | Performing Operations; Transporting | 116 | Active |
| US7364986B2 | Laser beam processing method and laser beam machine | Performing Operations; Transporting | 115 | Expired |
| US7507639B2 | Wafer dividing method | Performing Operations; Transporting | 113 | Active |
| US7468309B2 | Semiconductor wafer treatment method | Electricity | 112 | Active |
| US7435607B2 | Method of wafer laser processing using a gas permeable protective tape | Electricity | 111 | Expired |
| US6344402B1 | Method of dicing workpiece | Electricity | 79 | Expired |
| US6386466B1 | Cleaning apparatus | Electricity | 65 | Expired |
| US4521995A | Wafer attracting and fixing device | Electricity | 64 | Expired |
| US8422119B1 | Compensation of beam walkoff in nonlinear crystal using cylindrical lens | Electricity | 50 | Active |
| US9878397B2 | SiC wafer producing method | Performing Operations; Transporting | 46 | Active |
| US9481051B2 | Wafer producing method | Performing Operations; Transporting | 42 | Active |
| US9620415B2 | Wafer processing method | Electricity | 39 | Active |
| US4131267A | Apparatus for holding workpiece by suction | Performing Operations; Transporting | 38 | Expired |
| US6102023A | Precision cutting apparatus and cutting method using the same | Emerging Cross-Sectional Technologies | 37 | Expired |
| US6606985B2 | Dual-cutting method devoid of useless strokes | Emerging Cross-Sectional Technologies | 32 | Expired |
| US9868177B2 | Wafer producing method | Performing Operations; Transporting | 32 | Active |
| US6659098B1 | Rotary tool including a cutting blade and cutting apparatus comprising the same | Performing Operations; Transporting | 30 | Expired |
| US9517530B2 | Wafer producing method | Performing Operations; Transporting | 28 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.