Circuit structure and manufacturing method thereof
US10051748B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2016 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Jan 18, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4644
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.