Patent assignee · TW · COMPANY

UNIMICRON TECHNOLOGY CORP.

494Patents
485Active
494Granted
59Portfolio score

Filing activity: Jul 21, 2000 → Jan 8, 2024 · 112 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US6506632B1 Method of forming IC package having downward-facing chip cavity Electricity 101 Expired
US7839649B2 Circuit board structure having embedded semiconductor element and fabrication method thereof Electricity 46 Active
US8709865B2 Fabrication method of packaging substrate having through-holed interposer embedded therein Electricity 38 Active
US6506633B1 Method of fabricating a multi-chip module package Electricity 35 Expired
US8999759B2 Method for fabricating packaging structure having embedded semiconductor element Electricity 35 Active
US6709897B2 Method of forming IC package having upward-facing chip cavity Electricity 34 Expired
US8269337B2 Packaging substrate having through-holed interposer embedded therein and fabrication method thereof Electricity 32 Active
US9514629B2 Vehicle door opening warning system and vehicle door opening warning method Physics 26 Active
US7968991B2 Stacked package module and board having exposed ends Electricity 26 Active
US8519270B2 Circuit board and manufacturing method thereof Emerging Cross-Sectional Technologies 25 Active
US8736033B1 Embedded electronic device package structure Electricity 21 Active
US7969745B2 Circuit board structure having electronic components integrated therein Electricity 17 Active
US9635757B1 Circuit board and manufacturing method thereof Electricity 15 Active
US7906850B2 Structure of circuit board and method for fabricating same Emerging Cross-Sectional Technologies 12 Active
US9385056B2 Packaging substrate having embedded interposer and fabrication method thereof Emerging Cross-Sectional Technologies 10 Active
US7700986B2 Chip package carrier and fabrication method thereof Electricity 10 Active
US8181342B2 Method for manufacturing a coreless packaging substrate Emerging Cross-Sectional Technologies 10 Active
US7284323B2 Process of fabricating conductive column Emerging Cross-Sectional Technologies 10 Expired
US8033014B2 Method of making a molded interconnect device Emerging Cross-Sectional Technologies 9 Active
US7829987B2 Carrier structure embedded with semiconductor chips and method for manufacturing the same Electricity 9 Active
US8187478B2 Fabricating process of structure with embedded circuit Emerging Cross-Sectional Technologies 9 Active
US9374896B2 Packaging carrier and manufacturing method thereof and chip package structure Emerging Cross-Sectional Technologies 9 Active
US7820233B2 Method for fabricating a flip chip substrate structure Electricity 8 Active
US8502370B2 Stack package structure and fabrication method thereof Electricity 7 Active
US7880296B2 Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon Electricity 7 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.