Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof
US10053359B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2016 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Oct 29, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2207/09
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Microelectronic packages and methods for producing microelectronic packages are provided. In one embodiment, the method includes bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece. The first MEMS die and cap piece are bonded such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer. A second MEMS die having a second MEMS transducer structure thereon is further bonded to one of the cap piece and the second MEMS die. The second MEMS die and the cap piece are bonded such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer. The second hermetically-sealed cavity contains a different internal pressure than does the first hermetically-sealed cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.