Inventor · Mesa, AZ, US

Stephen R. Hooper

63Patents
10h-index
45Co-inventors
78Inventor score

Filing activity: Dec 23, 2002 → Oct 11, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US7109055B2 Methods and apparatus having wafer level chip scale package for sensing elements Performing Operations; Transporting 51 Expired
US9499397B2 Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof Performing Operations; Transporting 43 Active
US10053359B2 Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof Performing Operations; Transporting 33 Active
US8359927B2 Molded differential PRT pressure sensor Electricity 32 Active
US7900521B2 Exposed pad backside pressure sensor package Electricity 21 Active
US7014888B2 Method and structure for fabricating sensors with a sacrificial gel dome Electricity 17 Expired
US7632698B2 Integrated circuit encapsulation and method therefor Electricity 14 Active
US9108841B1 Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof Electricity 14 Active
US9165886B2 Sensor packaging method and sensor packages Electricity 13 Active
US7834431B2 Leadframe for packaged electronic device with enhanced mold locking capability Electricity 11 Active
US8476087B2 Methods for fabricating sensor device package using a sealing structure Electricity 10 Active
US7316965B2 Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level Physics 9 Expired
US8659167B1 Sensor packaging method and sensor packages Electricity 7 Active
US9790089B2 MEMS sensor with side port and method of fabricating same Electricity 7 Active
US8686550B2 Method and apparatus for high pressure sensor device Electricity 7 Active
US9446940B2 Stress isolation for MEMS device Performing Operations; Transporting 6 Active
US8841758B2 Semiconductor device package and method of manufacture Emerging Cross-Sectional Technologies 5 Active
US8384168B2 Sensor device with sealing structure Electricity 5 Active
US9818656B1 Devices and methods for testing integrated circuit devices Electricity 5 Active
US9638597B2 Differential pressure sensor assembly Electricity 4 Active
US9365414B2 Sensor package having stacked die Electricity 4 Active
US9470652B1 Sensing field effect transistor devices and method of their manufacture Electricity 4 Active
US11031681B2 Package integrated waveguide Electricity 3 Active
US8906747B2 Cavity-type semiconductor package and method of packaging same Electricity 3 Active
US9663350B2 Stress isolated differential pressure sensor Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.