Clustering for prediction models in process control and for optimal dispatching
US10054938B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2015 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Apr 30, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45032
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A first embodiment is a method for semiconductor process control comprising clustering processing tools of a processing stage into a tool cluster based on processing data and forming a prediction model for processing a semiconductor wafer based on the tool cluster. A second embodiment is a method for semiconductor process control comprising providing cluster routes between first stage tool clusters and second stage tool clusters, assigning a comparative optimization ranking to each cluster route, and scheduling processing of wafers. The comparative optimization ranking identifies comparatively which cluster routes provide for high wafer processing uniformity. Further, wafers that require high wafer processing uniformity are scheduled to be processed along one cluster route that has a high comparative optimization ranking that identifies the one cluster route to have a highest wafer processing uniformity, and wafers that do not require high wafer processing uniformity are scheduled to be processed along another cluster route.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.