Kewei Zuo
20Patents
4h-index
32Co-inventors
59Inventor score
Filing activity: Jun 27, 2007 → Mar 14, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7974728B2 | System for extraction of key process parameters from fault detection classification to enable wafer prediction | Physics | 49 | Active |
| US8682466B2 | Automatic virtual metrology for semiconductor wafer result prediction | Physics | 8 | Active |
| US9010617B2 | Solder joint reflow process for reducing packaging failure rate | Electricity | 5 | Active |
| US8433434B2 | Near non-adaptive virtual metrology and chamber control | Physics | 4 | Active |
| US8945983B2 | System and method to improve package and 3DIC yield in underfill process | Electricity | 3 | Active |
| US10964566B2 | Machine learning on overlay virtual metrology | Physics | 2 | Active |
| US7972969B2 | Method and apparatus for thinning a substrate | Electricity | 2 | Active |
| US11626304B2 | Machine learning on overlay management | Physics | 1 | Active |
| US9390491B2 | System and method for automatic quality control for assembly line processes | Electricity | 1 | Active |
| US9037279B2 | Clustering for prediction models in process control and for optimal dispatching | Physics | 1 | Active |
| US9390060B2 | Packaging methods, material dispensing methods and apparatuses, and automated measurement systems | Electricity | 1 | Active |
| US9508653B2 | Die-tracing in integrated circuit manufacturing and packaging | Electricity | 1 | Active |
| US8905124B2 | Temperature controlled loadlock chamber | Electricity | 0 | Active |
| US12237188B2 | Machine learning on overlay management | Physics | 0 | Active |
| US9177843B2 | Preventing contamination in integrated circuit manufacturing lines | Emerging Cross-Sectional Technologies | 0 | Active |
| US9698030B2 | Temperature controlled loadlock chamber | Electricity | 0 | Active |
| US10054938B2 | Clustering for prediction models in process control and for optimal dispatching | Physics | 0 | Active |
| US12197138B2 | Machine learning on overlay management | Physics | 0 | Active |
| US9153506B2 | System and method for through silicon via yield | Electricity | 0 | Active |
| US9588505B2 | Near non-adaptive virtual metrology and chamber control | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.