Semiconductor wafer device and manufacturing method thereof
US10056285B2 · kind B2 · utility
1Cited by
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20Claims
0Family size
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Key dates
| Filing date | Oct 23, 2017 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Oct 23, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P80/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of dies singulation includes providing a carrier, disposing a plurality of dies over a surface of the carrier according to a plurality of scribe lines comprising a plurality of continuous lines along a first direction and a plurality of discontinuous lines along a second direction, cutting the carrier according to the plurality of continuous lines along the first direction, and cutting the carrier according to the plurality of discontinuous lines along the second direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.