Apparatus for treating surfaces of wafer-shaped articles
US10056287B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2015 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Sep 30, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/3493
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.