Patent · US Active

Common-source packaging structure

US10056355B2 · kind B2 · utility

0Cited by

3References

6Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR CO., LTD. · TW

Inventors

Chien-Chung Chen · New Taipei, TW
Sen Mao
Hsin-Liang Lin · New Taipei, TW

Key dates

Filing date	Nov 3, 2017
Grant date	Aug 21, 2018
Priority date	—
Expiry date	Nov 3, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18301
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A common-source type package structure is provided in the present invention. In the package structure, an integrated component body is configured a common-source pin region, a first arrangement region and a second arrangement region. The second and first arrangement regions are spaced apart from each other. A first MOSFET die and a second MOSFET are respectively located at the first and second arrangement region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed to the top surface and spaced apart from each other. A common-source connection element is connected to the source electrode pad and the common-source pin region. A gate connection element is connected to the gate electrode pad and a gate pin region of the integrated component body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.