Sen Mao
14Patents
7h-index
13Co-inventors
59Inventor score
Filing activity: Jun 12, 2001 → Nov 3, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7394150B2 | Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys | Electricity | 24 | Expired |
| US7238551B2 | Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys | Electricity | 22 | Expired |
| US9589929B2 | Method for fabricating stack die package | Electricity | 22 | Active |
| US6744119B2 | Leadframe having slots in a die pad | Electricity | 9 | Expired |
| US8471381B2 | Complete power management system implemented in a single surface mount package | Electricity | 8 | Active |
| US8586419B2 | Semiconductor packages including die and L-shaped lead and method of manufacture | Electricity | 8 | Active |
| US9966330B2 | Stack die package | Electricity | 7 | Active |
| US10546840B2 | Method for fabricating stack die package | Electricity | 3 | Active |
| US8928138B2 | Complete power management system implemented in a single surface mount package | Electricity | 2 | Active |
| US9093359B2 | Complete power management system implemented in a single surface mount package | Electricity | 1 | Active |
| US6414362B1 | Power semiconductor device | Electricity | 0 | Expired |
| US10090298B2 | Integrated packaging structure | Electricity | 0 | Active |
| US9997500B1 | Common-source packaging structure | Electricity | 0 | Active |
| US10056355B2 | Common-source packaging structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.