Method for controlling chemical mechanical polishing process
US10058974B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2017 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Mar 31, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for performing a CMP process is provided. The method includes performing the CMP process. The method further includes during the CMP process detecting a motion of a carrier head about a rotation axis beside a polishing pad. The method also includes producing a control signal corresponding to a detected result of the motion. In addition, the method includes prohibiting the rotation of the carrier head about a rotation axis by a driving motor which is controlled by the control signal. And, the method includes selecting a point of time at which the CMP process is terminated after the control signal is substantially the same as a threshold value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.