Backing plate for a sputter target, sputter target, and sputter device
US10060023B2 · kind B2 · utility
0Cited by
4References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2012 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Jan 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3482
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A backing plate for a sputter target includes a target receiving part for receiving a target to be sputtered, and a structure for exposing the target receiving part through the backing plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.