Patent assignee · DE · COMPANY

Infineon Technologies AG

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14,943Patents
9,399Active
14,943Granted
59Portfolio score

Filing activity: Sep 18, 1995 → Sep 6, 2024 · 2,859 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US7298009B2 Semiconductor method and device with mixed orientation substrate Electricity 544 Expired
US6531412B2 Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications Electricity 518 Expired
US7163900B2 Using polydentate ligands for sealing pores in low-k dielectrics Electricity 503 Expired
US7274867B2 System and method for determining the temperature of a semiconductor wafer Physics 455 Expired
US7528755B2 Sigma-delta modulator for operating sensors Physics 361 Active
US6789939B2 Temperature sensor and method for operating a temperature sensor Physics 323 Expired
US7288435B2 Method for producing a cover, method for producing a packaged device Electricity 283 Expired
US7297574B2 Multi-chip device and method for producing a multi-chip device Electricity 282 Expired
US8835978B2 Lateral transistor on polymer Electricity 281 Active
US8963321B2 Semiconductor device including cladded base plate Electricity 275 Active
US7054376B1 High data rate ethernet transport facility over digital subscriber lines Electricity 270 Expired
US7223612B2 Alignment of MTJ stack to conductive lines in the absence of topography Electricity 267 Expired
US6421820B1 Semiconductor device fabrication using a photomask with assist features Physics 249 Expired
US6479373B2 Method of structuring layers with a polysilicon layer and an overlying metal or metal silicide layer using a three step etching process with fluorine, chlorine, bromine containing gases Electricity 229 Expired
US7158359B2 Circuit configuration having a semiconductor switch and a protection circuit Electricity 211 Expired
US7166533B2 Phase change memory cell defined by a pattern shrink material process Electricity 200 Expired
US7214958B2 Phase change memory cell with high read margin at low power operation Physics 199 Expired
US7041568B2 Method for the production of a self-adjusted structure on a semiconductor wafer Electricity 197 Expired
US9723716B2 Contact pad structure, an electronic component, and a method for manufacturing a contact pad structure Emerging Cross-Sectional Technologies 194 Active
US6893972B2 Process for sidewall amplification of resist structures and for the production of structures having reduced structure size Electricity 192 Expired
US7469391B2 Method and device of analyzing crosstalk effects in an electronic device Physics 191 Active
US7200021B2 Stacked DRAM memory chip for a dual inline memory module (DIMM) Electricity 185 Expired
US6745380B2 Method for optimizing and method for producing a layout for a mask, preferably for use in semiconductor production, and computer program therefor Physics 181 Expired
US7772039B2 Procedure for arranging chips of a first substrate on a second substrate Electricity 171 Expired
US6707098B2 Electronic device and method for fabricating an electronic device Emerging Cross-Sectional Technologies 170 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.