Patent · US Active

Pressure sensor module having a sensor chip and passive devices within a housing

US10060819B2 · kind B2 · utility

1Cited by

8References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Mathias Vaupel · Regensburg, DE
Matthias Boehm · Neuendettelsau, DE
Steven Gross · Northville, US
Markus Loehndorf · Munich, DE
Stephan Schmitt · Munich, DE
Horst Theuss · Wenzenbach, DE
Helmut Wietschorke · Laberweinting, DE

Key dates

Filing date	Nov 19, 2015
Grant date	Aug 28, 2018
Priority date	—
Expiry date	Jul 7, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/48137
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.