Semiconductor package and method of forming the same
US10062648B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2016 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Jun 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/1058
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment is a structure including a first die having an active surface with a first center point, a molding compound at least laterally encapsulating the first die, and a first redistribution layer (RDL) including metallization patterns extending over the first die and the molding compound. A first portion of the metallization patterns of the first RDL extending over a first portion of a boundary of the first die to the molding compound, the first portion of the metallization patterns not extending parallel to a first line, the first line extending from the first center point of the first die to the first portion of the boundary of the first die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.