Wei-Cheng Wu
394Patents
14h-index
200Co-inventors
85Inventor score
Filing activity: Mar 9, 2007 → May 9, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9372206B2 | Testing of semiconductor chips with microbumps | Electricity | 1,637 | Active |
| US9048233B2 | Package systems having interposers | Electricity | 960 | Active |
| US9425126B2 | Dummy structure for chip-on-wafer-on-substrate | Electricity | 819 | Active |
| US7969193B1 | Differential sensing and TSV timing control scheme for 3D-IC | Electricity | 228 | Active |
| US10163802B2 | Fan-out package having a main die and a dummy die, and method of forming | Electricity | 65 | Active |
| US10062648B2 | Semiconductor package and method of forming the same | Electricity | 61 | Active |
| US9997464B2 | Dummy features in redistribution layers (RDLS) and methods of forming same | Electricity | 57 | Active |
| US9741690B1 | Redistribution layers in semiconductor packages and methods of forming same | Electricity | 33 | Active |
| US9128123B2 | Interposer test structures and methods | Electricity | 29 | Active |
| US8283781B2 | Semiconductor device having pad structure with stress buffer layer | Electricity | 25 | Active |
| US9812460B1 | NVM memory HKMG integration technology | Electricity | 16 | Active |
| US10347606B2 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Electricity | 15 | Active |
| US10510674B2 | Fan-out package having a main die and a dummy die, and method of forming | Electricity | 15 | Active |
| US9583591B2 | Si recess method in HKMG replacement gate technology | Electricity | 15 | Active |
| US9659953B2 | HKMG high voltage CMOS for embedded non-volatile memory | Electricity | 13 | Active |
| USD932243S1 | Combustion device | General | 13 | Active |
| US8558229B2 | Passivation layer for packaged chip | Electricity | 13 | Active |
| US10650882B2 | Static random access memory with a supplementary driver circuit and method of controlling the same | Physics | 13 | Active |
| US10175294B2 | Testing of semiconductor chips with microbumps | Electricity | 12 | Active |
| USD910901S1 | Fuel container | General | 12 | Active |
| US10468410B2 | Metal gate modulation to improve kink effect | Electricity | 12 | Active |
| USD909549S1 | Combustion burner | General | 11 | Active |
| USD909663S1 | Fuel container | General | 11 | Active |
| US9633869B2 | Packages with interposers and methods for forming the same | Electricity | 11 | Active |
| US9812426B1 | Integrated fan-out package, semiconductor device, and method of fabricating the same | Electricity | 11 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.