Recessed cavity in printed circuit board protected by LPI
US10064292B2 · kind B2 · utility
0Cited by
65References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 8, 2016 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Apr 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A PCB has multiple stacked layers laminated together, the laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure having a low adhesion to an underlying conductive layer, such as an LPI mixture. The LPI mixture defines cavity dimensions and enables the use of regular flow prepreg in the laminated stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.