Multek Technologies Limited
23Patents
23Active
23Granted
51Portfolio score
Filing activity: Aug 19, 2014 → Aug 27, 2019
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9521748B1 | Mechanical measures to limit stress and strain in deformable electronics | Electricity | 7 | Active |
| US10009992B2 | PCB hybrid redistribution layer | Electricity | 6 | Active |
| US9867290B2 | Selective segment via plating process and structure | Electricity | 6 | Active |
| US9661743B1 | Flexible circuit board and method of fabricating | Emerging Cross-Sectional Technologies | 4 | Active |
| US9560746B1 | Stress relief for rigid components on flexible circuits | Electricity | 4 | Active |
| US9763327B2 | Selective segment via plating process and structure | Electricity | 3 | Active |
| US9723713B1 | Flexible printed circuit board hinge | Electricity | 3 | Active |
| US10123603B1 | Diffuse fiber optic lighting for luggage | Physics | 3 | Active |
| US9521754B1 | Embedded components in a substrate | Electricity | 2 | Active |
| US10321560B2 | Dummy core plus plating resist restrict resin process and structure | Electricity | 2 | Active |
| US10466118B1 | Stretchable flexible durable pressure sensor | Physics | 2 | Active |
| US9999134B2 | Self-decap cavity fabrication process and structure | Electricity | 1 | Active |
| US9549463B1 | Rigid to flexible PC transition | Electricity | 1 | Active |
| US9992880B2 | Rigid-bend printed circuit board fabrication | Emerging Cross-Sectional Technologies | 1 | Active |
| US10772220B2 | Dummy core restrict resin process and structure | Emerging Cross-Sectional Technologies | 1 | Active |
| US10015880B1 | Rip stop on flex and rigid flex circuits | Electricity | 1 | Active |
| US9736947B1 | Nano-copper via fill for enhanced thermal conductivity of plated through-hole via | Electricity | 0 | Active |
| US10458778B2 | Inline metrology on air flotation for PCB applications | Electricity | 0 | Active |
| US10712398B1 | Measuring complex PCB-based interconnects in a production environment | Physics | 0 | Active |
| US10292279B2 | Disconnect cavity by plating resist process and structure | Electricity | 0 | Active |
| US10449729B1 | 3D printed fiber optics | Performing Operations; Transporting | 0 | Active |
| US9659478B1 | Wearable electronic stress and strain indicator | Electricity | 0 | Active |
| US10064292B2 | Recessed cavity in printed circuit board protected by LPI | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.