Apparatus and methods for multi-die packaging
US10068841B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
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Key dates
| Filing date | Jun 22, 2017 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Jun 22, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device assembly includes an interposer having an opening extending from a first major surface to a second major surface of the interposer and a plurality of external connectors on the second major surface. The first major surface of the interposer is attached to a packaged semiconductor device. The opening of the interposer exposes the packaged semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.