Wei Gao
14Patents
4h-index
29Co-inventors
56Inventor score
Filing activity: Oct 23, 2008 → Oct 31, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10507278B2 | Fluidic devices, methods, and systems | Human Necessities | 67 | Active |
| US8329509B2 | Packaging process to create wettable lead flank during board assembly | Electricity | 15 | Active |
| US9721881B1 | Apparatus and methods for multi-die packaging | Emerging Cross-Sectional Technologies | 8 | Active |
| US9362211B1 | Exposed pad integrated circuit package with mold lock | Electricity | 5 | Active |
| US10083912B2 | Method of packaging integrated circuit die and device | Electricity | 3 | Active |
| US11433172B2 | Fluidic devices, methods, and systems | Human Necessities | 3 | Active |
| US9142434B2 | Method for singulating electronic components from a substrate | Electricity | 2 | Active |
| US10068841B2 | Apparatus and methods for multi-die packaging | Emerging Cross-Sectional Technologies | 1 | Active |
| US8735223B2 | Semiconductor devices and methods of assembling same | Electricity | 1 | Active |
| US9034697B2 | Apparatus and methods for quad flat no lead packaging | Electricity | 0 | Active |
| US10494627B2 | Extraction of materials from regions of interest in a sample | Physics | 0 | Active |
| US9625355B2 | Extraction of materials from regions of interest in a sample | Physics | 0 | Active |
| US10598577B2 | Photodegradable sample collection system and method | Physics | 0 | Active |
| US10283477B2 | Method of fabricating 3-dimensional fan-out structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.