Integrated circuit package with embedded bridge

US10068852B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Ravindranath V. Mahajan · Chandler, US
• Christopher J. Nelson · Hiram, US
• Omkar G. Karhade · Chandler, US
• Feras Eid · Chandler, US
• Nitin A. Deshpande · Chandler, US
• Shawna M. Liff · Scottsdale, US

Key dates

• Filing date: Jun 28, 2017
• Grant date: Sep 4, 2018
• Expiry date: Jun 28, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19104
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the present disclosure are directed towards an integrated circuit (IC) package having first and second dies with first and second input/output (I/O) interconnect structures, respectively. The IC package may include a bridge having first and second electrical routing features coupled to a portion of the first and second I/O interconnect structures, respectively. In embodiments, the first and second electrical routing features may be disposed on one side of the bridge; and third electrical routing features may be disposed on an opposite side. The first and second electrical routing features may be configured to route electrical signals between the first die and the second die and the third electrical routing features may be configured to route electrical signals between the one side and the opposite side. The first die, the second die, and the bridge may be embedded in electrically insulating material. Other embodiments may be described and/or claimed.