Inventor · Chandler, AZ, US

Feras Eid

188Patents
6h-index
116Co-inventors
73Inventor score

Filing activity: Nov 18, 2011 → Apr 11, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US9275955B2 Integrated circuit package with embedded bridge Electricity 42 Active
US9735893B1 Patch system for in-situ therapeutic treatment Human Necessities 34 Active
US8633551B1 Semiconductor package with mechanical fuse Electricity 26 Active
US9147633B2 Heat removal in an integrated circuit assembly using a jumping-drops vapor chamber Emerging Cross-Sectional Technologies 15 Active
US9967040B2 Patch system for in-situ therapeutic treatment Human Necessities 13 Active
US10068852B2 Integrated circuit package with embedded bridge Electricity 7 Active
US9559037B2 Package integrated synthetic jet device Electricity 6 Active
US9716067B2 Integrated circuit package with embedded bridge Electricity 6 Active
US11469206B2 Microelectronic assemblies Electricity 6 Active
US10039186B2 Stretchable and flexible electrical substrate interconnections Electricity 5 Active
US10424559B2 Thermal management of molded packages Electricity 5 Active
US9992859B2 Low loss and low cross talk transmission lines using shaped vias Electricity 5 Active
US9260294B2 Integration of pressure or inertial sensors into integrated circuit fabrication and packaging Performing Operations; Transporting 4 Active
US9200973B2 Semiconductor package with air pressure sensor Electricity 4 Active
US9505607B2 Methods of forming sensor integrated packages and structures formed thereby Performing Operations; Transporting 4 Active
US9345184B2 Magnetic field shielding for packaging build-up architectures Emerging Cross-Sectional Technologies 4 Active
US10651525B2 Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs Electricity 4 Active
US9711428B2 Dual-sided die packages Electricity 4 Active
US9893438B1 Electrical connectors for high density attach to stretchable boards Electricity 4 Active
US11688665B2 Thermal management solutions for stacked integrated circuit devices Electricity 4 Active
US11050155B2 Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems Electricity 4 Active
US11227859B2 Stacked package with electrical connections created using high throughput additive manufacturing Electricity 4 Active
US10951248B1 Radio frequency (RF) module with shared inductor Electricity 4 Active
US11147197B2 Microelectronic package electrostatic discharge (ESD) protection Electricity 3 Active
US12107060B2 Microelectronic assemblies with inductors in direct bonding regions Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.