Integrated circuit package having rectangular aspect ratio
US10068866B2 · kind B2 · utility
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16References
14Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 29, 2016 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Sep 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) packaging arrangement for surface mounting of the IC includes a package body that encapsulates one or more IC dies. The package body according to some embodiments has rectangular aspect ratio with a length dimension and a width dimension of different size. The IC packaging according to some embodiments includes leadless surface-mount electrical contacts. According to some embodiments, the leadless surface-mount contacts are situated in clusters at opposite ends of the length dimension of the IC body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.