Scot Kellar
15Patents
9h-index
8Co-inventors
65Inventor score
Filing activity: Sep 12, 2001 → Mar 16, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7157787B2 | Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices | Electricity | 765 | Expired |
| US6762076B2 | Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices | Electricity | 521 | Expired |
| US6661085B2 | Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack | Electricity | 492 | Expired |
| US6887769B2 | Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same | Electricity | 455 | Expired |
| US7037804B2 | Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration | Electricity | 231 | Expired |
| US6975016B2 | Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof | Electricity | 225 | Expired |
| US7056807B2 | Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack | Electricity | 222 | Expired |
| US6911373B2 | Ultra-high capacitance device based on nanostructures | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6599808B2 | Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode | Emerging Cross-Sectional Technologies | 12 | Expired |
| US7265406B2 | Capacitor with conducting nanostructure | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7244983B2 | Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7271434B2 | Capacitor with insulating nanostructure | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7091084B2 | Ultra-high capacitance device based on nanostructures | Emerging Cross-Sectional Technologies | 3 | Expired |
| US12242315B2 | Thermal management in horizontally or vertically stacked dies | Emerging Cross-Sectional Technologies | 0 | Active |
| US10068866B2 | Integrated circuit package having rectangular aspect ratio | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.