Patent · US Active

Semiconductor package device and method of manufacturing the same

US10069051B2 · kind B2 · utility

0Cited by
0References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 10, 2017
Grant dateSep 4, 2018
Priority date—
Expiry dateJan 10, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/0364
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed on the first carrier. The aperture is positioned over the first electronic component and exposes the first electronic component. The second electronic component is disposed on the second carrier. The encapsulant covers the second electronic component. The lens defines a cavity and is disposed on the aperture of the first carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.