Patent assignee · TW · COMPANY

ADVANCED SEMICONDUCTOR ENGINEERING, INC.

1,862Patents
1,466Active
1,862Granted
62Portfolio score

Filing activity: Dec 20, 1995 → Mar 22, 2024 · 322 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US7242081B1 Stacked package structure Electricity 345 Expired
US9461001B1 Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same Electricity 290 Active
US6400004B1 Leadless semiconductor package Electricity 272 Expired
US6291271A Method of making semiconductor chip package Electricity 200 Expired
US6238952A Low-pin-count chip package and manufacturing method thereof Electricity 174 Expired
US7642133B2 Method of making a semiconductor package and method of making a semiconductor device Electricity 159 Active
US6452270B1 Semiconductor device having bump electrode Electricity 142 Expired
US6921968B2 Stacked flip chip package Electricity 140 Expired
US8012797B2 Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries Electricity 137 Active
US6306685A Method of molding a bump chip carrier and structure made thereby Electricity 133 Expired
US7061079B2 Chip package structure and manufacturing method thereof Electricity 129 Expired
US7550836B2 Structure of package on package and method for fabricating the same Electricity 117 Active
US7829961B2 MEMS microphone package and method thereof Electricity 115 Active
US7005750B2 Substrate with reinforced contact pad structure Emerging Cross-Sectional Technologies 114 Expired
US6262490A Substrate strip for use in packaging semiconductor chips Electricity 112 Expired
US8035213B2 Chip package structure and method of manufacturing the same Electricity 110 Active
US6342730B1 Low-pin-count chip package and manufacturing method thereof Electricity 106 Expired
US8278746B2 Semiconductor device packages including connecting elements Electricity 106 Active
US7576415B2 EMI shielded semiconductor package Electricity 105 Active
US6489218B1 Singulation method used in leadless packaging process Electricity 101 Expired
US6680529B2 Semiconductor build-up package Electricity 99 Expired
US6261864A Low-pin-count chip package and manufacturing method thereof Electricity 96 Expired
US7002805B2 Thermal enhance MCM package and manufacturing method thereof Electricity 92 Expired
US6258626A Method of making stacked chip package Electricity 92 Expired
US6528893B2 Low-pin-count chip package and manufacturing method thereof Electricity 89 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.