Formation of dielectric with smooth surface
US10070537B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2016 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Jul 25, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1978
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface, curing the second surface while the laminate remains applied, and removing the laminate. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.