Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation
US10073351B2 · kind B2 · utility
1Cited by
8References
16Claims
0Family size
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Key dates
| Filing date | Dec 9, 2015 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | Dec 9, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A photoresist or semiconductor manufacturing residue stripping and cleaning composition comprising water, one or more alkaline compounds, one or more corrosion inhibitors, and one or more oxidized products of one or more antioxidants, the method of making the composition and the method of using the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.