Exposure method of wafer substrate, manufacturing method of semiconductor device, and exposure tool
US10073354B2 · kind B2 · utility
2Cited by
3References
20Claims
0Family size
Assignee
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Key dates
| Filing date | May 7, 2015 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | May 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/30
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.