Inventor · Taichung, TW

Meng-Wei Chen

20Patents
4h-index
50Co-inventors
62Inventor score

Filing activity: Apr 18, 2003 → May 7, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US8148232B2 Overlay mark enhancement feature Electricity 13 Active
US8822343B2 Enhanced FinFET process overlay mark Electricity 11 Active
US8850369B2 Metal cut process flow Electricity 10 Active
US7097945B2 Method of reducing critical dimension bias of dense pattern and isolation pattern Physics 5 Expired
US8455982B2 Overlay mark enhancement feature Electricity 2 Active
US9129974B2 Enhanced FinFET process overlay mark Electricity 2 Active
US10146141B2 Lithography process and system with enhanced overlay quality Physics 2 Active
US10073354B2 Exposure method of wafer substrate, manufacturing method of semiconductor device, and exposure tool Electricity 2 Active
US8203836B2 Cover structure Physics 1 Active
US8562843B2 Integrated circuit method with triple patterning Electricity 1 Active
US11003091B2 Method of fabricating reticle Electricity 1 Active
US8840796B2 Integrated circuit method with triple patterning Electricity 1 Active
US10461037B2 Method for forming semiconductor device structure with overlay grating Electricity 1 Active
US10534272B2 Method of fabricating reticle Electricity 1 Active
US8716139B2 Method of patterning a semiconductor device Electricity 0 Active
US9773671B1 Material composition and process for mitigating assist feature pattern transfer Physics 0 Active
US10734325B2 Method for forming semiconductor device structure with overlay grating Electricity 0 Active
US8237297B2 System and method for providing alignment mark for high-k metal gate process Electricity 0 Active
US11940737B2 Method of fabricating reticle Electricity 0 Active
US10867933B2 Method for forming semiconductor device structure with overlay grating Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.