Package structure and method of fabricating the same
US10074615B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2017 |
| Grant date | Sep 11, 2018 |
| Priority date | — |
| Expiry date | Oct 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1431
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure including at least one conductive plate, a redistribution layer, a first semiconductor chip, a conductive shielding structure and an insulating encapsulant is provided. The first semiconductor chip is sandwiched in between the at least one conductive plate and the redistribution layer, wherein the first semiconductor chip is disposed on the at least one conductive plate and electrically connected to the redistribution layer. The conductive shielding structure is sandwiched in between the at least one conductive plate and the redistribution layer, wherein the conductive shielding structure surrounds the first semiconductor chip and electrically connects the at least one conductive plate with the redistribution layer. The insulating encapsulant is disposed on the redistribution layer, encapsulating the first semiconductor chip, the conductive shielding structure, and surrounding the at least one conductive plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.