Inventor · Tainan, TW

Ying-Cheng Tseng

31Patents
3h-index
27Co-inventors
55Inventor score

Filing activity: May 3, 2017 → Feb 20, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US10832985B2 Sensor package and method Electricity 5 Active
US10840227B2 Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device Electricity 5 Active
US10074615B1 Package structure and method of fabricating the same Electricity 4 Active
US11004786B2 Package structure and method of forming the same Electricity 3 Active
US10861841B2 Semiconductor device with multiple polarity groups Electricity 1 Active
US10762319B2 Fingerprint sensor and manufacturing method thereof Electricity 1 Active
US11929318B2 Package structure and method of forming the same Electricity 1 Active
US11355466B2 Package structure and manufacturing method of package structure thereof Electricity 1 Active
US11374136B2 Semiconductor package and forming method thereof Electricity 1 Active
US10396419B2 Common-mode signal absorber Electricity 0 Active
US12334434B2 Package structure and method of forming the same Electricity 0 Active
US11855232B2 Semiconductor package and forming method thereof Electricity 0 Active
US11158555B2 Package structure having sensor die with touch sensing electrode, and method of fabricating the same Electricity 0 Active
US11847852B2 Manufacturing method of fingerprint sensor Electricity 0 Active
US12051666B2 Package structure and manufacturing method of package structure thereof Electricity 0 Active
US11164819B2 Semiconductor package and manufacturing method thereof Electricity 0 Active
US10658348B2 Semiconductor devices having a plurality of first and second conductive strips Electricity 0 Active
US12113022B2 Semiconductor package and manufacturing method of semiconductor package Electricity 0 Active
US12015017B2 Package structure, package-on-package structure and method of fabricating the same Electricity 0 Active
US11842993B2 Semiconductor device with multiple polarity groups Electricity 0 Active
US11011501B2 Package structure, package-on-package structure and method of fabricating the same Electricity 0 Active
US11631658B2 Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device Electricity 0 Active
US11742254B2 Sensor package and method Electricity 0 Active
US11527525B2 Semiconductor device with multiple polarity groups Electricity 0 Active
US11049850B2 Methods of bonding the strip-shaped under bump metallization structures Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.