Multiple rank high bandwidth memory
US10079052B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Apr 3, 2018 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | Apr 3, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus related to multiple rank high bandwidth memory are described. In one embodiment, a semiconductor package includes a high bandwidth memory with multiple ranks. Other embodiments are also disclosed and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.