Patent · US Active

Method of using a barrier-seed tool for forming fine pitched metal interconnects

US10079176B2 · kind B2 · utility

2Cited by
3References
20Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJul 18, 2016
Grant dateSep 18, 2018
Priority date—
Expiry dateJul 18, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67167
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A barrier seed tool is configured to clean trenches in a first chamber, line the trenches with a diffusion barrier layer, and form a copper seed layer over the diffusion barrier layer in a second chamber. The clean chamber is configured to reduce overhangs in the copper seed layer by producing a plasma comprising positively and negatively charged ions including halogen ions, filtering the plasma to selectively exclude positively charged ions, and bombarding with the filtered plasma. The tool and related method can be used to reduce overhangs and improve subsequent gap fill while avoiding excessive damage to the dielectric matrix.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.