Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package
US10079225B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2017 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | Apr 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments of mechanisms for forming through package vias (TPVs) with openings surrounding end-portions of the TPVs and a package on package (PoP) device with bonding structures utilizing the TPVs are provided. The openings are formed by removing materials, such as by laser drill, surrounding the end-portions of the TPVs. The openings surrounding the end-portions of the TPVs of the die package enable solders of the bonding structures formed between another die package to remain in the openings without sliding and consequently increases yield and reliability of the bonding structures. Polymers may also be added to fill the openings surrounding the TPVs or even the space between the die packages to reduce cracking of the bonding structures under stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.