Inventor · Baoshan, TW

Jui-Pin Hung

138Patents
16h-index
51Co-inventors
85Inventor score

Filing activity: Mar 29, 2006 → Mar 28, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US9048222B2 Method of fabricating interconnect structure for package-on-package devices Electricity 971 Active
US9000584B2 Packaged semiconductor device with a molding compound and a method of forming the same Electricity 935 Active
US9263511B2 Package with metal-insulator-metal capacitor and method of manufacturing the same Electricity 915 Active
US9064879B2 Packaging methods and structures using a die attach film Electricity 754 Active
US8877554B2 Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices Electricity 600 Active
US8829676B2 Interconnect structure for wafer level package Electricity 579 Active
US8703542B2 Wafer-level packaging mechanisms Electricity 568 Active
US8785299B2 Package with a fan-out structure and method of forming the same Electricity 563 Active
US9378982B2 Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package Electricity 44 Active
US9373527B2 Chip on package structure and method Electricity 43 Active
US8952544B2 Semiconductor device and manufacturing method thereof Electricity 38 Active
US9111914B2 Fan out package, semiconductor device and manufacturing method thereof Electricity 37 Active
US9159678B2 Semiconductor device and manufacturing method thereof Electricity 35 Active
US8779599B2 Packages including active dies and dummy dies and methods for forming the same Electricity 34 Active
US9425121B2 Integrated fan-out structure with guiding trenches in buffer layer Electricity 19 Active
US9460987B2 Interconnect structure for package-on-package devices and a method of fabricating Electricity 19 Active
US9431367B2 Method of forming a semiconductor package Electricity 15 Active
US9368438B2 Package on package (PoP) bonding structures Electricity 13 Active
US10269778B2 Package on package (PoP) bonding structures Electricity 13 Active
US8827695B2 Wafer's ambiance control Emerging Cross-Sectional Technologies 12 Active
US8916972B2 Adhesion between post-passivation interconnect structure and polymer Electricity 12 Active
US9935080B2 Three-layer Package-on-Package structure and method forming same Electricity 12 Active
US9922903B2 Interconnect structure for package-on-package devices and a method of fabricating Electricity 11 Active
US9553000B2 Interconnect structure for wafer level package Electricity 10 Active
US10079225B2 Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package Electricity 9 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.