Circuit board interconnection structure and circuit board interconnection method
US10080298B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2014 |
| Grant date | Sep 18, 2018 |
| Priority date | — |
| Expiry date | Jun 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10234
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a circuit board interconnection structure including: a first circuit board including a first substrate and a first electrode formed on a surface of the first substrate; a second circuit board including a second substrate and a second electrode formed on a surface of the second substrate; one or more joining portions formed of a metal-containing conductive material for joining the first and second electrodes, interposed between the first and second electrodes; and a reinforcing resin portion for reinforcing the one or more joining portions. The first electrode is a transparent electrode including a metal oxide film. A first abutting portion of the joining portion abutting the first electrode, is formed by adhesional wetting of the first electrode with the conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.