Hideki Eifuku
24Patents
6h-index
12Co-inventors
66Inventor score
Filing activity: Apr 12, 1996 → Jan 12, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6000127A | Electronic parts mounting method | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6209196A | Method of mounting bumped electronic components | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6179198A | Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps | Emerging Cross-Sectional Technologies | 21 | Expired |
| US5962925A | Mounting structure of electronic component having bumps | Electricity | 17 | Expired |
| US8434665B2 | Electronic component mounting system and electronic component mounting method | Electricity | 13 | Active |
| US7793413B2 | Method of mounting electronic components | Emerging Cross-Sectional Technologies | 6 | Active |
| US7797822B2 | Electronic component mounting method | Emerging Cross-Sectional Technologies | 6 | Active |
| US5749510A | Semiconductor chip bonding method | Electricity | 6 | Expired |
| US8034447B2 | Electronic components mounting adhesive and electronic components mounting structure | Emerging Cross-Sectional Technologies | 5 | Active |
| US9756728B2 | Component-mounted structure | Electricity | 3 | Active |
| US10080298B2 | Circuit board interconnection structure and circuit board interconnection method | Electricity | 3 | Active |
| US7845074B2 | Method for manufacturing electronic parts module | Emerging Cross-Sectional Technologies | 2 | Active |
| US8148253B2 | Electronic component soldering structure and electronic component soldering method | Emerging Cross-Sectional Technologies | 2 | Active |
| US7886432B2 | Electric components connecting method | Emerging Cross-Sectional Technologies | 2 | Active |
| US9949380B2 | Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component | Electricity | 1 | Active |
| US9015932B2 | Connecting method of electronic component | Emerging Cross-Sectional Technologies | 1 | Active |
| US8188605B2 | Components joining method and components joining structure | Electricity | 1 | Active |
| US8025205B2 | Electronic component mounting method | Electricity | 1 | Active |
| US8018074B2 | Components joining method and components joining structure | Electricity | 1 | Active |
| US10034389B2 | Electric component mounting method | Emerging Cross-Sectional Technologies | 1 | Active |
| US8817487B2 | Electronic component mounting system and electronic component mounting method | Electricity | 0 | Active |
| US9839143B2 | Electrode joining method, production method of electrode joined structure | Emerging Cross-Sectional Technologies | 0 | Active |
| US8851138B2 | Substrate backing device and substrate thermocompression-bonding device | Emerging Cross-Sectional Technologies | 0 | Active |
| US7841081B2 | Method for manufacturing electronic parts module | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.