Selective processing of a workpiece
US10081861B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2015 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Apr 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32385
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods for the selective processing of the outer portion of a workpiece are disclosed. The outer portion is processed by directing an ion beam toward the workpiece, where the ion beam extends beyond the outer edge of the workpiece at two locations. The workpiece is then rotated relative to the ion beam about the center so that all regions of the outer portion are exposed to the ion beam. The workpiece may be rotated an integral number of rotations. The ion beam may perform any process, such as ion implantation, etching or deposition. The outer portion may be an annular ring having an outer diameter equal to that of the workpiece and having a width of 1 to 30 millimeters. The rotation of the workpiece may be aligned with a notch on the outer edge of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.