Patent · US Active

Inductor interconnect

US10083922B2 · kind B2 · utility

1Cited by

5References

22Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Min Suet Lim · Kampung Bukit Kechil, MY
Chin Lee Kuan · Bentong, MY
Eng Huat Goh · Air Itam, MY
Khang Choong Yong · Puchong, MY
Bok Eng Cheah · Air Itam, MY
Jackson Chung Peng Kong · Merang, MY
Howe Yin Loo · Bayan Lepas, MY

Key dates

Filing date	Nov 23, 2016
Grant date	Sep 25, 2018
Priority date	—
Expiry date	Nov 23, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/13
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device and method of utilizing spiral interconnects for voltage and power regulation are shown. Examples of spiral interconnects include air core inductors. An integrated circuit package attached to a motherboard using spiral interconnects is shown. Methods of attaching an integrated circuit package to a motherboard using spiral interconnects are shown including air core inductors. Methods of attaching spiral interconnects include using electrically conductive adhesive or solder.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.