Min Suet Lim
81Patents
6h-index
80Co-inventors
71Inventor score
Filing activity: Mar 28, 2014 → Dec 27, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10515912B2 | Integrated circuit packages | Electricity | 34 | Active |
| US9972589B1 | Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer | Electricity | 23 | Active |
| USD773452S1 | Electronic device with flexible hinge | General | 14 | Active |
| USD756349S1 | Portable computing device with low profile hinge | General | 12 | Active |
| US9360896B2 | Low-profile hinge for an electronic device | Physics | 7 | Active |
| US10036187B2 | Micro-hinge for an electronic device | Emerging Cross-Sectional Technologies | 6 | Active |
| US10503211B2 | Multi-orientation display device | Physics | 6 | Active |
| US10041282B2 | Micro-hinge for an electronic device | Emerging Cross-Sectional Technologies | 5 | Active |
| US10796999B2 | Floating-bridge interconnects and methods of assembling same | Electricity | 4 | Active |
| US10319698B2 | Microelectronic device package having alternately stacked die | Electricity | 3 | Active |
| US11710029B2 | Methods and apparatus to improve data training of a machine learning model using a field programmable gate array | Physics | 3 | Active |
| US10633898B2 | Micro-hinge for an electronic device | Emerging Cross-Sectional Technologies | 2 | Active |
| US11320883B2 | Multi-die stacks with power management | Emerging Cross-Sectional Technologies | 2 | Active |
| US10317938B2 | Apparatus utilizing computer on package construction | Electricity | 2 | Active |
| US11006514B2 | Three-dimensional decoupling integration within hole in motherboard | Electricity | 2 | Active |
| US10083922B2 | Inductor interconnect | Electricity | 1 | Active |
| US10643983B2 | Extended stiffener for platform miniaturization | Electricity | 1 | Active |
| US10153253B2 | Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus | Electricity | 1 | Active |
| US11658127B2 | RFI free picture frame metal stiffener | Electricity | 1 | Active |
| US9836095B1 | Microelectronic device package electromagnetic shield | Electricity | 1 | Active |
| US10256213B2 | Reduced-height electronic memory system and method | Electricity | 1 | Active |
| US11030012B2 | Methods and apparatus for allocating a workload to an accelerator using machine learning | Physics | 1 | Active |
| US10085342B2 | Microelectronic device having an air core inductor | Electricity | 1 | Active |
| US12146476B2 | Flexible vapor chamber with shape memory material | Electricity | 1 | Active |
| US10840177B2 | Interposer with flexible portion | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.