Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US10084949B2 · kind B2 · utility
4Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2017 |
| Grant date | Sep 25, 2018 |
| Priority date | — |
| Expiry date | Mar 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N2213/001
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.