Inventor · Zhejiang, CN

Liang Ding

97Patents
9h-index
74Co-inventors
77Inventor score

Filing activity: Dec 27, 2006 → May 26, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US11165509B1 Method for co-packaging light engine chiplets on switch substrate Electricity 34 Active
US9651751B1 Compact optical transceiver by hybrid multichip integration Emerging Cross-Sectional Technologies 22 Active
US10001611B2 Optical transceiver by FOWLP and DoP multichip integration Electricity 12 Active
US11677478B2 Method for co-packaging light engine chiplets on switch substrate Electricity 12 Active
US11612079B2 Heatsink for co-packaged optical switch rack package Electricity 12 Active
US8532440B2 Silicon-based electro-optic device Physics 11 Active
US10566287B1 Light engine based on silicon photonics TSV interposer Electricity 11 Active
US9876948B2 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof Electricity 10 Active
US11178473B1 Co-packaged light engine chiplets on switch substrate Physics 10 Active
US9826132B2 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device Electricity 9 Active
US11109515B1 Heatsink for co-packaged optical switch rack package Electricity 9 Active
US9671557B1 Vertical integration of hybrid waveguide with controlled interlayer thickness Physics 9 Active
US10924269B1 Compact optical module integrated for communicating cryptocurrency transaction Electricity 8 Active
US9894772B2 Manufacturing method of molded photosensitive assembly for electronic device Electricity 8 Active
US8154586B2 Projection system and method of curved film Physics 5 Active
US9876949B2 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof Electricity 5 Active
US9781325B1 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device Electricity 4 Active
US9892249B2 Methods and devices for authorizing operation Electricity 4 Active
US9461687B2 Mobile terminal and specific absorption rate reduction method Electricity 4 Active
US10084949B2 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof Electricity 4 Active
US9906700B2 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device Electricity 4 Active
US10222573B2 Adjustable optical lens and camera module and manufacturing method thereof Electricity 3 Active
US10367983B2 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof Electricity 3 Active
US9885831B2 Vertical integration of hybrid waveguide with controlled interlayer thickness Physics 3 Active
US10197890B2 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.