Apparatus and method for measuring thickness
US10088297B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2017 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Mar 21, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/56
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed are apparatuses and methods for measuring a thickness. The apparatus for measuring a thickness including a light source that emits a femto-second laser, an optical coupler through which a portion of the femto-second laser is incident onto a target and other portion of the femto-second laser is incident onto a reference mirror, a detector configured to receive a reflection signal reflected on the reference mirror and a sample signal generated from the target and configured to measure a thickness of the target based on an interference signal between the reflection signal and the sample signal, and a plurality of optical fiber lines configured to connect the light source, the optical coupler, and the detector to each other may be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.