Method for separating substrates and semiconductor chip
US10090198B2 · kind B2 · utility
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12Claims
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Inventor
Key dates
| Filing date | Aug 6, 2014 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Aug 7, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method for separating a substrate (1) along a separation pattern (4), in which method a substrate (1) is provided and an auxiliary layer (3) is applied to the substrate, said layer covering the substrate at least along the separation pattern. The substrate comprising the auxiliary layer is irradiated, such that the material of the auxiliary layer penetrates the substrate along the separation pattern in the form of an impurity. The substrate is broken along the separation pattern. A semiconductor chip (15) is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.