Mathias Kaempf
8Patents
1h-index
13Co-inventors
44Inventor score
Filing activity: Apr 29, 2004 → Dec 18, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10115869B2 | Optoelectronic semiconductor chip, optoelectronic component and method for singulating semiconductor chips | Electricity | 1 | Active |
| US10276748B2 | Radiation-emitting semiconductor chip, method for producing a plurality of radiation-emitting semiconductor chips and optoelectronic component having a radiation-emitting semiconductor chip | Electricity | 1 | Active |
| US7445119B2 | Chip receptacle, method for fabricating a chip receptacle and chip transport container | Emerging Cross-Sectional Technologies | 1 | Active |
| US9728459B2 | Method for singulating an assemblage into semiconductor chips, and semiconductor chip | Electricity | 1 | Active |
| US10090198B2 | Method for separating substrates and semiconductor chip | Performing Operations; Transporting | 0 | Active |
| US9165816B2 | Method for singulating a component composite assembly | Electricity | 0 | Active |
| US9873166B2 | Method for dividing a composite into semiconductor chips, and semiconductor chip | Electricity | 0 | Active |
| US10232471B2 | Method for dividing a composite into semiconductor chips, and semiconductor chip | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.