Patent · US Active

Microelectronic package debug access ports and methods of fabricating the same

US10090261B2 · kind B2 · utility

0Cited by

2References

14Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Florence R. Pon · Folsom, US
Bilal Khalaf · Folsom, US
Saeed S. Shojaie · Folsom, US

Key dates

Filing date	Mar 28, 2017
Grant date	Oct 2, 2018
Priority date	—
Expiry date	Mar 28, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A microelectronic package may be fabricated with debug access ports formed either at a side or at a bottom of the microelectronic package. In one embodiment, the debug access ports may be formed within an encapsulation material proximate the microelectronic package side. In another embodiment, the debug access ports may be formed in a microelectronic interposer of the microelectronic package proximate the microelectronic package side. In a further embodiment, the debug access ports may be formed at the microelectronic package bottom and may include a solder contact.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.