Method of forming solder bump, and solder bump
US10090268B2 · kind B2 · utility
1Cited by
2References
16Claims
0Family size
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Key dates
| Filing date | Jul 27, 2015 |
| Grant date | Oct 2, 2018 |
| Priority date | — |
| Expiry date | Dec 7, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.