Minoru Ueshima
35Patents
5h-index
59Co-inventors
68Inventor score
Filing activity: Jan 8, 2003 → Aug 9, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7282175B2 | Lead-free solder | Performing Operations; Transporting | 18 | Expired |
| US7682468B2 | Lead-free solder alloy | Electricity | 13 | Active |
| US7338567B2 | Lead-free solder alloy | Electricity | 11 | Expired |
| US8845826B2 | Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder | Electricity | 8 | Active |
| US7800230B2 | Solder preform and electronic component | Electricity | 7 | Active |
| US7029542B2 | Lead-free solder alloy | Performing Operations; Transporting | 5 | Expired |
| US7628308B2 | Method of replenishing an oxidation suppressing element in a solder bath | Electricity | 3 | Expired |
| US8216395B2 | Lead-free solder alloy | Emerging Cross-Sectional Technologies | 3 | Active |
| US9796053B2 | High-temperature lead-free solder alloy | Electricity | 3 | Active |
| US9162324B2 | Solder paste and solder joint | Electricity | 2 | Active |
| US9185812B2 | Lead-free solder paste | Electricity | 2 | Active |
| US8334598B2 | Power semiconductor device and manufacturing method therefor | Electricity | 2 | Active |
| US8303735B2 | Lead-free low-temperature solder | Electricity | 2 | Active |
| US10297539B2 | Electronic device including soldered surface-mount component | Electricity | 1 | Active |
| US10272527B2 | Solder alloy, and LED module | Electricity | 1 | Active |
| US9227258B2 | Lead-free solder alloy having reduced shrinkage cavities | Electricity | 1 | Active |
| US10090268B2 | Method of forming solder bump, and solder bump | Emerging Cross-Sectional Technologies | 1 | Active |
| US8343383B2 | Anisotropic conductive material | Electricity | 1 | Active |
| US8975757B2 | Lead-free solder connection structure and solder ball | Electricity | 1 | Active |
| US8865062B2 | High-temperature lead-free solder alloy | Electricity | 1 | Active |
| US8888932B2 | Indium-containing lead-free solder for vehicle-mounted electronic circuits | Electricity | 1 | Active |
| US12119131B2 | Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part | Electricity | 0 | Active |
| US7451805B2 | Pouring apparatus for molten metal and casting method | Emerging Cross-Sectional Technologies | 0 | Expired |
| US9807889B2 | Method of mounting electronic component to circuit board | Emerging Cross-Sectional Technologies | 0 | Active |
| US8790472B2 | Process for producing a solder preform having high-melting metal particles dispersed therein | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.